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The AccuSputter ® AW 4450-Series Production Sputtering Systems are manufactured­ in the configuration­ of a manually-loaded­ system capable of fully automatic operation. The AccuSputter ® AW 4450 sputtering head is equipped with three DeltaTM cathode or four round 8-inch positions ( Mo flame sprayed shields and shutters standard).
The AccuSputter ® AW 4450-Series Production Sputtering Systems deposit a wide variety of materials onto substrates such as ceramic, metal, plastics, glass and semiconductors.­ The system can also be used for RF sputter-etching,­ a process in which material is removed from, rather than being deposited on, the substrates prior to sputter deposition.

These sputtering systems sequentially­ deposit thin films of up to three or four different materials onto a single substrate, thus attaining sandwich-structu­red films such as multi-layer optical interference­ filters or semiconductor­ devices. Resulting thin films range in thickness from a few Angstroms up to several microns.

Description of Features:
Advanced AccuSputter ®AW4450 Controller with GUI mounted in the main frame;
Manual, Semi and Automatic one button operation;
Customer programming of recipe for process parameters.
GEM/SEC II functions (Optional)
24V DC control components
DC Gear Motors for table rotate and carriage moving;
Advanced vacuum gauges and control system;
MFC gas control system;
Advanced RF automatically­ matching network;
DC and RF power are mounted in the main frame;
Fast Cycle Load Lock Operation ;
High rate DeltaTM DC magnetron sputtering;
High throughput operation: Automated load lock and controller sequences provide for efficient pump down and pallet transfer to process chamber
High uniformity: ±7% deposition uniformity guaranteed with water-cooled­ rotating annular substrate table; ±5% achievable.
Ultra-clean vacuum: Cryopumped and Meissner-trapped­ process chamber ensures contamination-fr­ee conditions especially important for critical processes such as the deposition of aluminum and platinum;
Easy maintenance:­ Removable deposition shields permit easy system cleaning. Automatic cryopump regeneration­ minimizes downtime and inconvenience;­
Specialized pallets for ease of substrate leading/unloadin­g;
"Drop in" target for quick target changes, no screw to both with;
"Snap-out&q­uot; deposition shields for quick, easy maintenance;­
Fail-safe system protection
Download AccuSputter®­ AW 4450 Brochure for more information on The AccuSputter ® AW 4450-Series Production Sputtering Systems.

Or contact us by e-mail for more information on The AccuSputter ® AW 4450-Series Production Sputtering Systems.